Product Information

Low Profile and High Reliability ED Copper Foil [V9 Series]

By increasing the density of the roughening treatment particles compared to previous products, this ultra low roughness copper foil boasts stronger adhesion to various substrates without increasing roughness. In addition to adhesion strength, it also offers various other features that enhance functionality and directly improve board reliability, such as long-term heat resistance and chemical resistance.

Product Categories Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils
Main Applications Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards
Main ingredients Cu (copper)
Shape Rolled Sheets

Despite the low roughness, this foil offers high adhesion strength, heat resistance, and high chemical resistance for use in a wide variety of applications.

Product Catalogs

Related Products