Technical information

Terminology

A

Atomization

Atomization is a manufacturing method that creates metal powder by using gas or water to spray molten metal. [1]

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B

Bronze Powder

A flaked copper and zinc alloy powder. This powder is used as a metal powder pigment that provides a gold color and metallic brilliance. An alloy of copper and zinc is conventionally called brass, but in fields that print with gold colors, copper-zinc alloy powders have historically been referred to as gold or bronze powders. This nomenclature continues to this day.

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C

Chemical Reduction

Chemical reduction is a reduction technique that uses a reducing agent, instead of using hydrogen directly. [2]

Compactibility

compactibility is an important powder property for powder metallurgy. It refers to the ease or difficulty of molding a substance, including the minimum pressure required to provide the molded item with sufficient strength, and the properties of the molded item necessary to withstand handling after molding—especially to ensure that corners and protrusions are not easily damaged. [3]

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D

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E

Electrodeposition

This manufacturing method deposits powders on a cathode in a electrolysis tank. The main advantage is high purity. [1]

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F

Fully Alloyed Powders

This type of alloy powder consists of individual particles with the same homogeneous chemical composition as the overall bulk powder.[3][4]

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G

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H

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I

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J

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K

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L

Leafing Properties

This refers to a flaked metal powder's tendency to float to the surface of a coating, similar to floating leaves covering a water surface.

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M

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N

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O

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P

Polishing

Metallic brilliance or gloss can be obtained from bronze or other flaked metal powders used as a metal powder pigment in gold inks by coating the flakes with fatty acids.

Powder Metallurgy

This technology is used to manufacture metal powders or create materials or products by molding and sintering metal powders or a mixture of metal and non-metal powders. [3]

Partially Alloyed Powders

Partially alloyed powders are alloy powders that include particles that are not fully alloyed. [3][4]

Printed Circuit Boards

This term refers collectively to all insulating substrates that include a pattern of conductors, used to connect between electronic devices, printed on or inside that substrate based on a circuit design, but before any semiconductors, electronic components, or other devices mounted on the board. [5]

Pale Gold and Rich Gold

These terms indicate the color of gold pigments, where pale gold refers to a pigment color with a reddish-gold color produced from an alloy of 90 % copper and 10 % zinc. Rich gold refers to a metal powder pigment with a color similar to pure gold that is produced from an alloy of 75 % copper and 25 % zinc.

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Q

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R

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S

Sintering

Sintering generally refers to compressing primarily metal or ceramic powders into a solid form at temperatures below their melting point. [3]

Stamping

Stamping using a stamp mill to flatten metal powder into flakes, which involves pounding the metal powder with multiple metal pestle-like rods, until the particles are spread out into thin flakes.

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T

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U

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V

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W

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X

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Y

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Z

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Cited References

[1] Powder Metallurgy Science, R. M. German, 1996, [2] Encyclopedic Dictionary of Chemistry, Vol. 2 and 5, Encyclopedic Dictionary of Chemistry Editing Committee, 1962, [3] Powder Metallurgy Handbook, Edited by Japan Society of Powder Metallurgy, 2010, [4] JIS-Z-2500 Powder Metallurgy—Vocabulary [5] Japan Electronics Packaging and Circuits Association: Applicability, Structure, Terminology, Testing, Inspection, and Design of Printed Circuit Boards with Integrated Components, Fifth Edition JPCA-EB01 (2012), 2012..