A sub-micron level ultra fine roughening process, which has minimal effect on roughness, provides high adhesion strength even at ultra-low roughness levels. Microparticle adhesion is also very high, which ensures reliable operation without line contamination due to roughening particles becoming falling loose.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > RA Copper Foils |
|---|---|
| Main Applications | Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
This surface treated rolled copper foil is suitable for use in both two-layer and three-layer flexible circuit boards. |