Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thicknesses up to 140 µm for ED foil and up to 300 µm for RA foil. The surface treatment, which is based on electroplating technology, provides high board reliability that makes these foils ideal for various heat sink or high current board applications. Foils are available in either roll or sheet form. For thicknesses over 400 µm, contact a FUKUDA representative on a case-by-case basis.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils Metal Foils > Copper Foils > Ultra-Thin Foils Metal Foils > Copper Foils > RA Copper Foils |
|---|---|
| Main Applications | Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
This thick copper foil is treated with a surface treatment process that is backed by many years of experience. A wide range of thicknesses is available for either ED or rolled copper foils. |