Product Information

Ultra Very Low Profile ED Copper Foil [CF-T4X-SV]

The raw foil [SV], which has a glossy surface with ultra low roughness on both sides, is treated with FUKUDA's proprietary micro-roughening process [T4X] to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Product Categories Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils
Main Applications Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards
Main ingredients Cu (copper)
Shape Rolled Sheets

A wide selection of thicknesses is available, from a minimum thickness of 6 µm up to 35 µm. It features the lowest profile level available for roughened ED copper foils.

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