Product Information

ED Copper Foil with High Bendability [HD Series]

Due to a proprietary crystallization control process, this ED copper foil can be recrystallized after heating. The HD series boasts bendability equivalent to tough-pitch copper after recrystallization.

Product Categories Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils
Main Applications Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards
Main ingredients Cu (copper)
Shape Rolled

The foil offers both the high bendability and ultra low roughness equivalent to tough-pitch copper. This ED copper foil can be used as a substitute for rolled copper foil.

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