FUKUDA has developed porous copper sintered foil.
About Porous Copper Sintered Foil
- There are micron-sized voids that communicate three-dimensionally, and fluid movement in the foil is possible due to capillary action.
- There is a possibility of use in the field of heat dissipation measures.
- Please contact us for surface treatment.
Thichness 100 μm, Porosity 30 %
Inquiries and requests for small samples are welcome.