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Fukuda Metal Foil & Powder Co., Ltd.
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Electronics
EMI shielding

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EMI shieldingSearch by Application

List of productsNumber of results: 20

Filter:Main ingredients / Cu (copper)Shape / Rolled

Ultra Very Low Profile ED Copper Foil [CF-T4X-SV]

The raw foil [SV], which has a glossy surface with ultra low roughness on both sides, is treated with FUKUDA's proprieta...
Non-Roughened Ultra Very Low Profile ED Copper Foil [CF-T9DA-SV]

T9DA non-roughening treatment has been added to an SV ED copper foil with excellent low roughness to provide superior lo...
Low Profile and High Reliability ED Copper Foil [V9 Series]

By increasing the density of the roughening treatment particles compared to previous products, this ultra low roughness ...
ED Copper Foil with High Bendability [HD Series]

Due to a proprietary crystallization control process, this ED copper foil can be recrystallized after heating. The HD se...
ED Copper Foil for High Speed Transmission [FLEQ HD]

HD2 foil is a more advanced version of HD foil, that offers bending properties equivalent to tough-pitch copper. This is...
ED Copper Foil for High Speed Transmission [FLEQ HQ]

FUKUDA's proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials...
Ultra Thin Foil with Copper Foil Carrier [FUTF series]

In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil...
Conventional ED Copper Foil [HS/UN Series]

This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards. The UN series increases the sharpn...
Conventional ED Copper Foil [STD Series]

The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thi...
Thick Copper Foil for Heat Sink Boards

Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thickness...

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