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Filter:Main ingredients / Cu (copper)
In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil...
This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards. The UN series increases the sharpn...
The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thi...
Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thickness...
Both high visibility and the best transmission properties were achieved simultaneously by using raw RA foil with ultra l...
The T4X sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is...
A sub-micron level ultra fine roughening process, which has minimal effect on roughness, provides high adhesion strength...
This foil, a standard FUKUDA product sold for many years, is treated with an ultra fine sub-micron roughening process in...
This hybrid composite foil dramatically improves surface corrosion resistance without altering the superior conductivity...
This copper foil is tin-plated for EMI shielding applications. In addition to high shielding properties provided by copp...