Metal Stylist, Creating the Future
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Product Information
In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil...
This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards. The UN series increases the sharpn...
The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thi...
Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thickness...
Based on the high EMI shielding properties of copper, this foil is available in forms suitable for a variety of applicat...
Both high visibility and the best transmission properties were achieved simultaneously by using raw RA foil with ultra l...
The T4X sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is...
A sub-micron level ultra fine roughening process, which has minimal effect on roughness, provides high adhesion strength...
This foil, a standard FUKUDA product sold for many years, is treated with an ultra fine sub-micron roughening process in...
These nickel foils are manufactured using an electrolytic process to offer especially high purity. They are ideal for si...