In order to manufacture the powder particles with a fine spherical shape, technology was developed that uses a high-pressure rotating jet of water for atomization. This enables mass production of powder with a small mean particle size and minimal aggregation.
| Product Categories | Metal Powders > Ultra High Pressure Swirl Water Atomized Powders |
|---|---|
| Main Applications | Energy > Capacitors Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Electronic parts (conductor materials) > Capacitors Electronics > Electronic parts (conductor materials) > Films Electronics > Electronic parts (conductor materials) > Pastes Automobiles > Conductive materials |
| Main ingredients | Cu (copper) Ag (silver) Sn (tin) Fe-based (iron-based) |
| Manufacturing method | Ultra high pressure swirl water atomization |
| Shape | Spherical |
| Features |
Due to the fine size and spherical shape of particles, this powder offers low aggregation. Therefore, it is suitable, for example, for use in MIM and other powder metallurgy applications, for use as a conductive paste for electronic circuitry or capacitors in electronic fields, or as a bonding material for diamond tooling applications. |
| Grade | D50%-Diameter (μm) |
Tap Density (g/cm3) | Specific Surface Area (cm2/g) |
|---|---|---|---|
| Cu-HWQ 1.5 μm | 1-2 | 3.0-4.0 | 5000-8000 |
| Cu-HWQ 3 μm | 2-4 | 3.0-5.0 | 2500-4500 |
| Cu-HWQ 5 μm | 4-6 | 4.0-5.5 | 1500-3500 |
| Cu-HWQ 10 μm | 8-12 | 4.0-5.5 | 500-2000 |
| Cu-HWQ 20 μm | 16-24 | 4.0-5.5 | 500-2000 |
| Ag-HWQ 1.5 μm | 1-2 | 3.0-4.0 | 5000-8000 |
| Ag-HWQ 2.5 μm | 2-3.5 | 3.5-5.0 | 3000-4500 |
| Ag-HWQ 5 μm | 4-6 | 4.0-5.5 | 1500-3500 |
| Alloys (Fe and Cu-based) contact FUKUDA for more details. | |||
D50: Median Diameter, TD: Tap Density, BET: BET Specific Surface Area