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Fukuda Metal Foil & Powder Co., Ltd.
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Conductive materials

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Conductive materialsSearch by Application

List of productsNumber of results: 12

Filter:Main ingredients / Cu (copper)

Electrolytic Copper Powder [CE]

This copper powder is manufactured using an electrolytic process. The powder particles have a unique dendritic shape tha...
Electrolytic Copper Powder [FCC] (For Electric Materials)

By surface treating and pulverizing electrolytic copper powder, this product offers additional new properties.
Ultra High Pressure Swirl Water Atomized Super Fine Powder [HWQ]

In order to manufacture the powder particles with a fine spherical shape, technology was developed that uses a high-pres...
Ultra High Pressure Swirl Water Atomized Super Fine Flake Powder [HWF]

This flake powder is made by pulverizing the spherical fine powder "HWQ" produced by ultra high pressure swirling water.
Submicron-Sized Extra Fine Copper Powder [EFC]

This next-generation material is prepared by treating fine copper particles obtained by electrolytic-chemical reduction ...
Chemically Reduced Copper Powder [CuC-40]

CuC-40 is a copper powder manufactured by chemical reduction.
Silver-Coated Copper Powder

Silver-coated copper powder is a composite powder consisting of copper powder with a silver plating applied to its surfa...
Copper Core Ball

These metal balls consist of copper balls, which offer superior sphericity and size uniformity, as the core material. Th...
Lead-Free Solder Ball

These spherical metal balls are manufactured by spraying uniform droplets of molten metal within an inert gas environmen...
Various Plated Foils

Plating a metal foil with a dissimilar metal enables imbuing the metal foil with multiple functional properties. In addi...

12

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- Pastes
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