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Fukuda Metal Foil & Powder Co., Ltd.
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Electronics
Electronic parts (conductor materials)
Bonding materials

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List of productsNumber of results: 5

Filter:Main ingredients / Ag (silver)

SILCOAT Reduced Silver Powder [AgC]

SILCOAT AgC is a silver powder manufactured by chemical reduction.
SILCOAT Flake Silver Powder [AgC]

SILCOAT AgC (flakes) is a flaked powder obtained by pulverizing the SILCOAT silver powder.
NANOMELT Fine Flake Silver Powder [Ag-XF301S］

The Ag-XF series is a silver flake powder that features bulky thin flakes.
Copper Core Ball

These metal balls consist of copper balls, which offer superior sphericity and size uniformity, as the core material. Th...
Lead-Free Solder Ball

These spherical metal balls are manufactured by spraying uniform droplets of molten metal within an inert gas environmen...

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- Dendritic
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