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Fukuda Metal Foil & Powder Co., Ltd.
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Electronics
Electronic parts (conductor materials)
Circuit conductors

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Circuit conductorsSearch by Application

List of productsNumber of results: 23

Filter:Main ingredients / Cu (copper)

Ultra High Pressure Swirl Water Atomized Super Fine Powder [HWQ]

In order to manufacture the powder particles with a fine spherical shape, technology was developed that uses a high-pres...
Ultra High Pressure Swirl Water Atomized Super Fine Flake Powder [HWF]

This flake powder is made by pulverizing the spherical fine powder "HWQ" produced by ultra high pressure swirling water.
Submicron-Sized Extra Fine Copper Powder [EFC]

This next-generation material is prepared by treating fine copper particles obtained by electrolytic-chemical reduction ...
Chemically Reduced Copper Powder [CuC-40]

CuC-40 is a copper powder manufactured by chemical reduction.
Ultra Very Low Profile ED Copper Foil [CF-T4X-SV]

The raw foil [SV], which has a glossy surface with ultra low roughness on both sides, is treated with FUKUDA's proprieta...
Non-Roughened Ultra Very Low Profile ED Copper Foil [CF-T9DA-SV]

T9DA non-roughening treatment has been added to an SV ED copper foil with excellent low roughness to provide superior lo...
Low Profile and High Reliability ED Copper Foil [V9 Series]

By increasing the density of the roughening treatment particles compared to previous products, this ultra low roughness ...
ED Copper Foil with High Bendability [HD Series]

Due to a proprietary crystallization control process, this ED copper foil can be recrystallized after heating. The HD se...
ED Copper Foil for High Speed Transmission [FLEQ HD]

HD2 foil is a more advanced version of HD foil, that offers bending properties equivalent to tough-pitch copper. This is...
ED Copper Foil for High Speed Transmission [FLEQ HQ]

FUKUDA's proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials...

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