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Fukuda Metal Foil & Powder Co., Ltd.
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Electronics
Electronic parts (conductor materials)

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Electronic parts (conductor materials)Search by Application

List of productsNumber of results: 6

Filter:Main ingredients / Sn (tin)

Ultra High Pressure Swirl Water Atomized Super Fine Powder [HWQ]

In order to manufacture the powder particles with a fine spherical shape, technology was developed that uses a high-pres...
Copper Core Ball

These metal balls consist of copper balls, which offer superior sphericity and size uniformity, as the core material. Th...
Lead-Free Solder Ball

These spherical metal balls are manufactured by spraying uniform droplets of molten metal within an inert gas environmen...
Tin Plated Rolled Copper Foil [SNA]

This copper foil is tin-plated for EMI shielding applications. In addition to high shielding properties provided by copp...
Various Materials

A variety of metal foils are available, such as copper, aluminum, stainless steel, nickel, titanium, and platinum foils....
Various Foil Processing

FUKUDA welcomes the opportunity to assist with manufacturing needs by providing metal foil processing services, such as ...

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