Metal Stylist, Creating the Future
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Product Information
HD2 foil is a more advanced version of HD foil, that offers bending properties equivalent to tough-pitch copper. This is...
FUKUDA's proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials...
In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil...
This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards. The UN series increases the sharpn...
The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thi...
Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thickness...
Based on the high EMI shielding properties of copper, this foil is available in forms suitable for a variety of applicat...
Both high visibility and the best transmission properties were achieved simultaneously by using raw RA foil with ultra l...
The T4X sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is...
A sub-micron level ultra fine roughening process, which has minimal effect on roughness, provides high adhesion strength...
