Metal Stylist, Creating the Future
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The raw foil [SV], which has a glossy surface with ultra low roughness on both sides, is treated with FUKUDA's proprieta...
T9DA non-roughening treatment has been added to an SV ED copper foil with excellent low roughness to provide superior lo...
By increasing the density of the roughening treatment particles compared to previous products, this ultra low roughness ...
Due to a proprietary crystallization control process, this ED copper foil can be recrystallized after heating. The HD se...
HD2 foil is a more advanced version of HD foil, that offers bending properties equivalent to tough-pitch copper. This is...
FUKUDA's proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials...
In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil...
This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards. The UN series increases the sharpn...
The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thi...
Based on copper's superior properties as a heat sink, thick copper foils for heat sink boards are available in thickness...
