By surface treating and pulverizing electrolytic copper powder, this product offers additional new properties.
| Product Categories | Metal Powders > Electrolytic Powder |
|---|---|
| Main Applications | Energy > Power generation equipment > Conductive materials Energy > Power generation equipment > Carbon brushes Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Automobiles > Carbon brushes Automobiles > EMI shielding Automobiles > Conductive materials |
| Main ingredients | Cu (copper) |
| Manufacturing method | Electrodeposition |
| Shape | Dendritic |
| Features |
FCC-115A is surface treated to offer improved wettability with respect to polymers for use as filler in EMI shielding paints. FCC-2000, FCC-SP-99, and FCC-TB powders are pulverized into a finer size to enable high fill rates, while still maintaining the dendritic form characteristic of electrolytic copper powders. |
| Grade | Apparent Density (g/cm3) |
Particle size distribution (mass %) | ||||||
|---|---|---|---|---|---|---|---|---|
| +180 μm | +150 μm | +106 μm | +75 μm | +63 μm | +45 μm | -45 μm | ||
| FCC-115A | - | - | - | - | - | ≦3 | ≦10 | ≧90 |
| FCC-2000 |
1.20-2.00 |
TD(g/cm3):2.7-3.7, HL(%):≦0.5 | ||||||
| FCC-SP-99 |
2.50-3.00 |
TD(g/cm3):3.8-4.3, HL(%):<0.29, D50(μm)≦13 | ||||||
| FCC-TB |
1.10-2.20 |
TD(g/cm3):2.3-3.6, D50(μm):5.5-8.0 | ||||||
TD : Tap Density HL : Hydrogen Loss D50 : 50%-Diameter