Product Information

Lead-Free Solder Ball

These spherical metal balls are manufactured by spraying uniform droplets of molten metal within an inert gas environment.

Product Categories Metal Powders > Metal Balls
Main Applications Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Bonding materials Automobiles > Conductive materials
Main ingredients Cu (copper) Ag (silver) Sn (tin)
Manufacturing method Uniform droplet spraying (metal balls)
Shape Spherical

These balls offer superior sphericity and size uniformity, with minimal surface oxidation. Balls can be manufactured in sizes ranging from 80 to 760 µm. A wide variety of compositions are available. Contact a FUKUDA representative for more details.

Grade Composition
Melting Temp.
Specific Gravity
FBM-Sn3.5Ag Sn96.5 Ag3.5 221 7.36
FBM-Sn3Ag0.5Cu Sn96.5 Ag3 Cu0.5 217-219 7.40
FBM-Sn9Zn Sn91 Zn9 199 7.30
FBM-Sn8Zn3Bi Sn89 Zn8 Bi3 190-197 7.30
Diameter Tolerance
80-300µm ±10µm
350-450µm ±10µm
500-760µm ±20µm

Contact a FUKUDA representative for compositions other than the above, such as Sn-Bi, or different diameter tolerances.

Related Products